Heater module for semiconductor production system

ABSTRACT

Heater module, and semiconductor manufacturing equipment in which the heater module is utilized, for raising the cooling speed of a post-heating heater markedly more than conventional, and that can contribute toward bettering and improving productivity, without accompanying scaling-up of and cost increases in the semiconductor manufacturing equipment. The heater module is furnished with heater part  1   a  for controlled heating of a wafer placed on its top face, and block part  3   a  provided to be shiftable relative to said heater part, for varying heat capacity in total with heater part  1   a  by abutting on or separating from the reverse surface of heater part  1   a . By having the heat capacity of block part  3   a  be 20% or more of the total heat capacity of heater part  1   a  and block part  3   a , the heater cooling speed can be made 10° C./min or more.

TECHNICAL FIELD

[0001] The present invention relates to heater modules, utilized insemiconductor manufacturing tools that process semiconductor wafers, forsemiconductor manufacturing equipment capable of heat-treating andcooling wafers, and to semiconductor manufacturing equipment in whichsuch heater modules are installed.

BACKGROUND ART

[0002] In the course of semiconductor fabrication, processes in whichafter being treated by heating wafers are cooled include: thermosettingof photoresists in photolithography with coater/developers;heating/baking of low-dielectric-constant, i.e. low-k, insulating films;CVD film deposition in forming metal interconnects and dielectriclayers; and processes in etchers.

[0003] Heat-treatment of the wafers in these processes hasconventionally been carried out using heaters made of aluminum orceramic. In particular, wafers are placed onto the outer face of heatersin which a heating element is formed, utilized to control heating whilethe wafers undergo processes such as thermosetting of photoresists andheating/baking of low-k films, or CVD film deposition and etching.

[0004] Recently, in order to enhance productivity in these processes, ithas become necessary to raise cooling speed for the post-heatingheaters. By the same token, designing for rapid cooling of the processedarticles to improve their characteristics has become widespread, and inparticular, accompanying the enlarging of wafer diametric span demandsfor enhanced cooling speed have been growing.

[0005] Forcible liquid cooling and air cooling have been adopted inorder to rapidly cool the heater in semiconductor manufacturingequipment applications to date. In specific terms, a cooling block isinstalled on the heater, usually on the reverse side, and by circulatingthrough the block a liquid or air as a heat-transferring medium forcooling, heat is carried away from the heater, heightening the coolingspeed.

[0006] Nevertheless, with these forcible liquid cooling and air coolingsystems, the fact that large-scale devices are necessary for circulatingthe heat-transferring medium and for radiating heat has proved to be acost-increasing factor in semiconductor manufacturing. Likewise, with itnot being possible to enlarge the capacity for the heat-transferringmedium within the limited space of the heater, significant improvementin heater cooling speed has been difficult.

DISCLOSURE OF INVENTION

[0007] An object of the present invention, in view of such circumstancesto date, is to render a heater module, and semiconductor manufacturingequipment in which the heater module is utilized, that makes it possibleto raise markedly the cooling speed of a post-heating heater, and thatcontributes toward bettering and improving productivity, withoutaccompanying scaling-up of and cost increases in the semiconductormanufacturing equipment.

[0008] In order to achieve the foregoing objective, for semiconductormanufacturing equipment a heater module that the present inventionrenders is characterized in being provided with a heater part forcontrolled heating of a wafer placed on its outer face, and a block partfurnished to be shiftable relative to the heater part, for varying heatcapacity in total with the heater part by abutting on and separatingfrom the reverse side of the heater part. In particular, the heatcapacity of the block part is 20% or more of the total heat capacity ofthe heater part and the block part.

[0009] An advantage of the foregoing heater module of the presentinvention for semiconductor manufacturing equipment is in a first aspectthat during heating the heater part and the block part are brought intoabutment, and during cooling, by the block part being relativelyshift-separated from the heater part, the cooling speed of the heaterpart is quickened. Another advantage is in a second aspect that duringheating the heater part and the block part are separated, and duringcooling, by the block part and the heater part being shifted relativelyinto abutment to conduct heat into the block part, the cooling speed ofthe heater part is quickened.

[0010] With the foregoing heater module of the present invention forsemiconductor manufacturing equipment, when the heater part and theblock part are in abutment, the block part is preferably fixed to theheater part by vacuum-chucking it thereto. In addition, at least one ofeither of the abutment surfaces along which the heater part and theblock part abut on each other preferably is a specular surface.

[0011] Furthermore, with the foregoing heater module of the presentinvention for semiconductor manufacturing equipment, the block part maybe affixed to the chamber bottom part in the semiconductor manufacturingequipment, or else may be shifted into abutment on the chamber bottompart. In that case, the chamber bottom part preferably is water-cooled.

[0012] In the foregoing heater module of the present invention forsemiconductor manufacturing equipment, the heater part preferably is aceramic in which a heating element is formed. The ceramic is preferablyat least one selected from the group consisting of aluminum oxide,aluminum nitride, silicon nitride, silicon carbide, and boron nitride.

[0013] In addition, in the foregoing heater module of the presentinvention for semiconductor manufacturing equipment, the block part ispreferably at least one selected from the group consisting of aluminum,magnesium, copper, iron, stainless steel, aluminum oxide, aluminumnitride, silicon nitride, silicon carbide, and boron nitride.

[0014] The foregoing heater module of the present invention forsemiconductor manufacturing equipment is preferably utilized in CVDequipment, etcher equipment, coater/developer equipment, or a low-kdielectric baking device.

[0015] Furthermore, the present invention renders semiconductormanufacturing equipment characterized in that installed therein is anabove-described heater module of the present invention for semiconductormanufacturing equipment.

BRIEF DESCRIPTION OF DRAWINGS

[0016]FIG. 1 is a schematic sectional view illustrating one specificexample of a heater module in a first aspect of the present invention;

[0017]FIG. 2 is a schematic sectional view illustrating one specificexample of a heater module in a second aspect of the present invention;and

[0018]FIG. 3 is a schematic sectional view illustrating a separatespecific example of a heater module in the second aspect of the presentinvention.

BEST MODE FOR CARRYING OUT THE INVENTION

[0019] When a heater that has been heated is being cooled, its heatcapacity is what affects the cooling speed. The larger the heat capacityof the heater is, the slower the cooling speed will be; conversely, thesmaller the heat capacity is, the faster the cooling speed will be.Conceivable as a means of lessening the heat capacity of the heater withthe objective of raising the cooling speed would be thinning the heaterthickness.

[0020] Meanwhile, wafers must be heated uniformly, and owing to theconsequent demand that the wafer-carrying surface of the heater behighly isothermal, exploiting the thickness of the heater to spread theheat generated by heating element uniformly in all directions isdesirable. Still, thinning the thickness of a heater in order toheighten its cooling speed gives rise to problems in that itseffectiveness in spreading heat uniformly is reduced, and the isothermalproperties in the wafer-carrying surface of the heater are harmed.

[0021] To address this situation, the present invention provides aheater part for controlled heating of a wafer placed on its outer faceand, shiftable relative to the heater part, a block part that may beabutted on as well as separated from the reverse side of the heaterpart. With a heater module configured in this way by the heater part andblock part, the total heat capacity of the heater part and the blockpart may be changed by the block part being in abutment against, andwith it being separated from, the reverse side of the heater part, andexploiting this varying of the total heat capacity enables bettering andenhancing both the isothermal properties, and at the same time thecooling speed, of the heater.

[0022] In particular, having the heat capacity of the block part be 20%or more of the total heat capacity of the heater part and the block partmakes even more heat be transmitted from the heater to the block partbeing in abutment on the heater, or else enables even more heat to bediffused to the surroundings from the heater being parted off the blockpart, on account of which cooling speeds that are all the higher may belooked forward to. It will be appreciated that the larger the heatcapacity of the block part, the more the cooling speed of the heaterpart may be boosted. Nevertheless, inasmusch as enlarging the heatcapacity of the block part means that the chamber—and the equipment as awhole—must be enlarged as well, the heat capacity of the block part mustbe planned taking into consideration the goal of cooling speedenhancement and the economics of the equipment overall.

[0023] One specific example of a first aspect of the present inventionin a heater module is depicted in FIG. 1. The heater module is furnishedwith heater part 1 a in the interior of which a heating element 2 isformed, and block part 3 a provided at the reverse side of heater part 1a to be shiftable up and down along guide shafts 4, wherein duringheating heater part 1 a and block part 3 a are in abutment, as indicatedin FIG. 1(a).

[0024] When the heater module is to heat, heater part 1 a and block part3 a are united to form a large-heat-capacity heater; and when it is tobe cooled, block part 3 a is, as depicted in FIG. 1(b), parted away fromheater part 1 a, descending toward the bottom part 5 of the equipmentchamber. Accordingly, heat radiation is promoted, and the cooling speedof heater part 1 a is hastened, by the fact that heater part 1 a is lefton its own with a smaller heat capacity.

[0025] Likewise, in the specific instance illustrated in FIG. 2 forexample, as the heater module in a second aspect, heater part 1 b andblock part 3 b as shown in FIG. 2(a) are separated during heating, andduring cooling block part 3 b is, as indicated in FIG. 2(b), elevated toabut on the reverse side of heater part 1 b, which is stationary. Theabutting of block part 1 b lets the cooling speed of heater part 1 b besped, because the heat in heater part 1 b is transmitted to block part 3b, which has individuated heat capacity.

[0026] In a heater module depicted in FIG. 3, farther in the secondaspect of the present invention, block part 3 c is stationary and heaterpart 1 c shifts up and down along the guide shafts 4, apart from whichthe heater module is the same as that of FIG. 2. In particular, duringheating, heater part 1 c and block part 3 care as shown in FIG. 3(a)separated, and during cooling, by bringing down heater part 1 c to abuton block part 3 c on the bottom part 5 of the chamber, as indicated inFIG. 3(b), the heat in heater part 1 c is transmitted to block part 3 b.

[0027] Factors influencing the transmission of heat from the heater partto the block part include contact resistance in the surfaces along whichthe heater part and block part abut. If the contact resistance is large,the isothermal properties and cooling speed of the heater part areliable to be affected because it takes time for heat to pass from theheater part. In light of this fact, forming through-holes in the topface of the block part or in the reverse face of the heater part andvacuum-chucking the two together under suction with a vacuum pump letsthe abutment surfaces of the heater part and the block part adhereclosely, dramatically lowering the contact resistance, which thereforeis advantageous in improving the cooling speed of the heater partespecially in the heater module in the second aspect.

[0028] Furthermore, with the heater module in the second aspect inparticular, the block part separated from the heater part during heatingis liable to be heated by radiant heat from the heater part. Given thissituation, processing either or both of the matching abutment surfacesof the heater part and the block part into a specular surface makesreflecting back radiant heat from the heater part possible. As a result,the clearance between the heater part and the block part when heating isunderway can be made smaller, which makes scaling-down the chamber aswell as the equipment possible.

[0029] What is more, if the heat that is transmitted to the block partis retained as such, improvement in the cooling speed of the heater partcould not be expected because the heat that is transmitted from theheater part when cooling is next underway would be kept from beingadequately absorbed. For that reason, it is preferable that after theblock part undergoes transmission of heat in contact with the heaterpart it is parted from the heater part and brought into contact with thebottom part of the chamber to send its heat into the chamber bottompart, whereby the block part cools quickly, readying it for the nextcooling. In that case, time to make ready for the next cooling may beshortened by water-cooling the chamber bottom part.

[0030] Here, it is preferable to employ oil pressure or air pressure inabutting as well as separating the heater part and block part, becausedoing so lets the heater part as well as the block part be shiftedsmoothly.

[0031] The heater part in the present invention may be either a metalsuch as aluminum or a ceramic, but is preferably a ceramic in which aheating element is formed. Preferable as the ceramic constituting theheater part is at least one selected from the group consisting ofaluminum oxide, aluminum nitride, silicon nitride, silicon carbide, andboron nitride.

[0032] Because both thermal and mechanical shock is exerted on theboundary surface of the heater part in abutting with the block part, thechances are high that cracking and like troubles will arise in theheater part with it being ceramic. Owing to this likelihood, such shockcan be mitigated by covering with metal a surface of the heater partmade from ceramic—at least the face that abuts with the block part—toprevent cracking or the like in the heater part.

[0033] Meanwhile, metal or ceramic whose thermal conductivity is highmay be utilized for the block part; preferable are, for example, Al, Mg,Cu, Fe, stainless steel, aluminum oxide, aluminum nitride, siliconnitride, silicon carbide, and boron nitride.

[0034] It is also preferable that the block part is either identical orsimilar to the heater part in form, and in that its diameter is within±25% of the diameter of the heater part. And it will be appreciated thatas stated above, the heat capacity of the block part preferably is 20%or more of the total heat capacity of the heater part and the blockpart.

[0035] The cooling speed of conventional heaters has generally been atthe 1° C./min level, because it has been dependent solely on radiantheat from a heater having a certain heat capacity. In contrast, in aheater module as defined by the present invention the cooling speed ofthe heater part, although it depends on the heat capacity of the blockpart, is enhanced to at least several times the conventional level.Specifically, cooling speeds of 10° C./min or more can be achieved ifthe heat capacity of the block part is designed to be 20% or more of thetotal heat capacity of the heater part and the block part, enablingproductivity to be dramatically improved. What is more, such improvementin cooling speed means that in terms of wafers, enhancement in theadhesive strength of thin films, enhancement in mechanical hardness, andenhancement in etching characteristics can be anticipated.

[0036] Another consideration is that in situations where a heater iscooled by heat radiation, with cooling speed being influenced by surfacearea, the temperature in the vicinity of the heater lateral side has agreater tendency to drop because the surface area there is generallylarge compared with the middle portion, and during cooling theisothermal quality is consequently liable to deteriorate. With a heatermodule as given by the present invention, however, the heater part coolsat a speed quite significantly faster than the speed of cooling throughthe lateral side, and especially with the heater module in the secondaspect, because heat passes to the block part by means of thermalconduction the isothermal quality during cooling is enhanced by a widemargin. In concrete terms, by optimizing the heater- and block-partparameters, it is possible to obtain an isothermal rating during coolingof within ±1%.

[0037] Utilizing a heater module of the present invention as describedabove in CVD equipment employed in deposition of metal films as well asdielectric films, in etcher equipment employed in etching metal films aswell as dielectric films, in coater/developer equipment employed inthermosetting of photoresists in photolithography, and in low-kdielectric baking devices employed in heating/baking of low-k films isespecially efficacious owing to the effect of enhanced heater coolingspeed.

[0038] What is more, semiconductor manufacturing equipment in which aheater module of the present invention is utilized is a means that canserve to heighten productivity and reduce costs, and by whichimprovement in both characteristics and performance of wafers and otherprocessed articles is recognizable.

EMBODIMENTS Embodiment 1

[0039] Sets of two disks 335 mm diameter and 10 mm thickness made of theceramic materials set forth in the table below were prepared, and on thetop face of one disk in each set a heating element was formed bytungsten metallization. Onto this ceramic disk the remaining ceramicdisk in each set was overlaid, putting the heating element into asandwich which was then hot-press joined using a hot press device,whereby ceramic heater parts were fabricated.

[0040] Block parts, made from each of the metal and ceramic materialsset forth in the following table and having the same diameter as theforegoing heater parts, were also fabricated. In doing so, the percentheat capacity of the block part with respect to the total heat capacityof the heater and block parts was varied as indicated in the table belowby varying the block part thickness. In addition, in all samples, thetop face of the block part (the face where it abuts with the heaterpart) was surfaced by lapping.

[0041] Heater modules in the first aspect according to the presentinvention were assembled using these heater parts and block parts. Thatis, they were lent a structure in which during heating the heater partand the block part abut, and in which during cooling the block part islowered to separate it from the heater part. It should be understoodthat elevation of the block part and its abutment onto/fixing againstthe heater part was by means of oil pressure or air pressure, andfurthermore that with Sample 6 only, the heater part and the block partwere held fast by vacuum-chucking. It should also be understood that thedistance between the heater part and the block part separated duringcooling was fixed at 200 mm with all of the samples.

[0042] Isothermal ratings for each of the sample heater modules havingbeen heated (200° C.) were found by applying a 200-V voltage to theheater part in abutment with the block part and heating to 200° C.,maintaining that temperature for 10 minutes, and then measuring thetemperature at 9 points within the top face (wafer-carrying surface) ofthe heater module. After that the block part was lowered to separate itfrom the heater part, and the speed with which the isolated heater part,left to radiate heat, cooled down to 150° C. was measured. In doing so,isothermal ratings when cooled (150° C.) were found from thetemperatures at the 9 points within the top face likewise as just noted.These results were tabulated and set forth in the following table. TABLEHeater part Block part Percent heat Shifting & Cooling speed Isothermalrating (± %) Sample material material capacity holding fast (° C./min)When heated When cooled 1 AlN Al 5 Oil press. 5 0.5 0.7 2 AlN Al 15 Oilpress. 7 0.5 0.7 3 AlN Al 20 Oil press. 10 0.5 0.7 4 AlN Al 100 Oilpress. 25 0.5 0.7 5 AlN Al 200 Oil press. 32 0.5 0.7 6 AlN Al 100 Vac.chuck. 27 0.5 0.7 7 AlN Al 100 Air press. 25 0.5 0.7 8 SiC Al 100 Oilpress. 23 0.6 0.8 9 Si₃N₄ Al 100 Oil press. 26 0.9 0.95 10 Al₂O₃ Al 100Oil press. 21 0.9 0.95 11 BN Al 100 Oil press. 33 0.4 0.6 12 AlN Mg 100Oil press. 22 0.5 0.7 13 AlN Cu 100 Oil press. 28 0.5 0.7 14 AlN Fe 100Oil press. 20 0.5 0.7 15 AlN SUS 100 Oil press. 18 0.5 0.7 16 AlN Al₂O₃100 Oil press. 18 0.5 0.7 17 AlN AlN 100 Oil press. 22 0.5 0.7 18 AlNSi₃N₄ 100 Oil press. 18 0.5 0.7 19 AlN AlN 100 Oil press. 23 0.5 0.7 20AlN BN 100 Oil press. 23 0.5 0.7

[0043] From the foregoing results, it is evident that with whichever ofthe samples as heater modules by the present invention highheater-cooling speeds of several ° C./min or faster were obtained, andthat isothermal ratings of within ±1% when heated and when cooled weresustained. In particular, it is evident by making the percent heatcapacity of the block part 20% or less, extremely high heater-coolingspeeds of 10° C./min or more can be achieved even as superior isothermalratings are maintained.

COMPARATIVE EXAMPLE

[0044] A heater part the same as that of the foregoing Embodiment 1 wasprepared, and an air-cool cooling block, made of aluminum, having a 60liter/min capacity was installed on the heater part, fixed on thereverse face thereof. It will be appreciated that a block part was notused in the comparative example. This heater that has been in use todate was heated to 200° C., which temperature was maintained for 10minutes, and then was cooled down to 150° C. by means of the air-coolcooling block.

[0045] In that instance, isothermal rating when heated and when cooled(150° C.) was found in the same way as in Embodiment 1. The results werea heater cooling speed of 1° C./min, and an isothermal rating of ±1.5%when heated and ±1.7% when cooled, which was considerably inferior tothat of the samples of the present invention in the foregoing Embodiment1.

Embodiment 2

[0046] A heater module was assembled utilizing the same heater part andblock part as with Sample 4 in the foregoing Embodiment 1, but thereverse face of the AlN-made heater part—i.e., the face where it abutswith the Al-made block part—was covered with a Cu layer 0.2 mm inthickness.

[0047] The same testing and evaluation as with Embodiment 1 wereperformed on this heater module, with the result being that the heatercooling speed and the isothermal rating were the same as with Sample 4in Embodiment 1. With Sample 4 in Embodiment 1, however, at 500 cycleschips 0.1-0.2 mm in diameter appeared in the edge of the reverse face ofthe heater part, but with the present Embodiment 2 sample, no chips orlike flaws were discernable at all.

Embodiment 3

[0048] A heater module was assembled utilizing the same heater part andblock part as with Sample 4 in the foregoing Embodiment 1, but the topface of the Al-made block part—i.e., the face where it abuts with theAIN-made heater part—was finished to a specular surface by a polishingprocess.

[0049] The same testing and evaluation as with Embodiment 1 wasperformed on this heater module. Thanks to the top face of the blockpart having been made mirror-like, heat radiant from the heater part wasreflected back, keeping the block part from absorbing the heat, andtherefore even with the separation between the heater part and the blockpart curtailed to 50 mm, the same heater cooling speed and isothermalrating as with Sample 4 in Embodiment 1, where the heater part-blockpart separation was set at 200mm, were obtained.

Embodiment 4

[0050] The heater module represented in FIG. 2, in the second aspect ofthe present invention, was assembled utilizing the same heater part andblock part as with Sample 4 in the foregoing Embodiment 1, but the blockpart was installed to be shiftable up and down by means of oil pressure.That is, the heater module was lent a structure in which during heatingthe heater part and the block part are separated and the block part isbrought into contact with, and rested on, the bottom part of thechamber, and during cooling, the block part is lifted to abut on theheater part. It should be understood that the remaining aspects of theheater module were exactly the same as with Sample 4 in Embodiment 1.

[0051] The isothermal rating of the heater part having been heated (200°C.) was found by heating it in isolation to 200° C., maintaining thattemperature for 10 minutes, and thereafter measuring its temperature at9 points within the top face. Subsequently, the block part was lifted toabut it on the heater part, the heater part was allowed to cool down to150° C., and the cooling speed was measured and the isothermal ratingwhen cooled (150° C.) was found.

[0052] The results were that the heater cooling speed and isothermalrating were the same as with Sample 4 in Embodiment 1. However, with theblock part, which had been lowered until it contacted the chamber bottompart, cooled down to room temperature the time until preparation for thenext cooling of the heater completed was shortened to ⅓ by comparisonwith Sample 4 in Embodiment 1.

Embodiment 5

[0053] The heater module represented in FIG. 3, in the second aspect ofthe present invention, was assembled utilizing the same heater part andblock part as with Sample 4 in the foregoing Embodiment 1, but theheater part was installed to be shiftable up and down by means of oilpressure. That is, the heater module was lent a structure in whichduring heating the heater part and the block part are separated and theblock part is brought into contact with, and rested on, the bottom partof the chamber, and during cooling, the heater part is lowered to abuton the heater part. It should be understood that the remaining aspectsof the heater module were exactly the same as with Sample 4 inEmbodiment 1.

[0054] The isothermal rating of the heater part having been heated (200°C.) was found by heating it in isolation to 200° C., maintaining thattemperature for 10 minutes, and thereafter measuring its temperature at9 points within the top face. Subsequently, the heater part was loweredto abut it on the block part, the heater part was allowed to cool downto 150° C., and the cooling speed was measured and the isothermal ratingwhen cooled (150° C.) was found.

[0055] The results were that the heater cooling speed and isothermalrating were the same as with Sample 4 in Embodiment 1. However, with theblock part, resting on and in constant contact with the chamber bottompart, cooled down to room temperature the time until preparation for thenext cooling of the heater completed was shortened to ⅓ by comparisonwith Sample 4 in Embodiment 1.

[0056] Embodiment 6

[0057] Heater modules identical with those of the foregoing Embodiment 4and comparative example were installed into place within a low-k filmbaking device, and an actual-practice implementation was made in which alow-k film coated onto a 12-inch Si wafer was cured.

[0058] With the low-k film cured in the baking device utilizing theheater module of Embodiment 4, the low-k film adhesive strength improved20% by comparison with the case with the baking device utilizing theheater module of the comparative example. In addition, the time for theheater to cool was curtailed to {fraction (1/25)} by comparison with thecomparative example.

INDUSTRIAL APPLICABILITY

[0059] As given by the present invention, for semiconductormanufacturing equipment a heater module may be rendered in which thecooling speed of the heater post-heating may be heightened several timesor more, preferentially 10 times or more, than conventional, and thatcan contribute toward bettering and improving productivity. What ismore, utilizing the heater module lets semiconductor manufacturingequipment be scaled down, and makes appreciable cost reduction possible.

1. A heater module for semiconductor manufacturing equipment,comprising: a heater part for controlled heating of a wafer placed on anobverse face thereof, and a block part installed in the heater module tobe shiftable relative to said heater part, for varying heat capacity intotal with said heater part by abutting on as well as separating from areverse surface of said heater part.
 2. A heater module forsemiconductor manufacturing equipment as set forth in claim 1, whereinthe heat capacity of said block part is 20% or more of the total heatcapacity of said heater part and said block part.
 3. A method ofoperating a heater module for semiconductor manufacturing equipment asset forth in claim 1, comprising: bringing said heater part and saidblock part into abutment when the heater module is to heat; andrelatively shift-separating said block part from said heater part whenthe heater module is to be cooled, to quicken the speed with which saidheater part cools.
 4. A method of operating a heater module forsemiconductor manufacturing equipment as set forth in claim 1,comprising: separating said heater part and said block part when theheater module is to heat; and relatively shifting said block part andsaid heater part into abutment for conducting heat into said block partwhen the heater module is to be cooled, to quicken the speed with whichsaid heater part cools.
 5. A method of operating a heater module forsemiconductor manufacturing equipment as set forth in claim 1,comprising vacuum-chucking said block part to said heater part when saidheater part and said block part are in abutment, fix said block part tosaid heater part.
 6. A heater module for semiconductor manufacturingequipment as set forth in claim 1, wherein at least one of either ofabutting surfaces along which said heater part and said block part abuton each other is planarized.
 7. A heater module for semiconductormanufacturing equipment as set forth in claim 1, wherein said block partis affixed to a bottom part of a chamber in the semiconductormanufacturing equipment.
 8. A heater module for semiconductormanufacturing equipment as set forth in claim 7, wherein the chamberbottom is water-cooled.
 9. A heater module for semiconductormanufacturing equipment as set forth in claim 1, wherein said heaterpart is made of ceramic, and a heating element is formed therein.
 10. Aheater module for semiconductor manufacturing equipment as set forth inclaim 9, wherein the ceramic is at least one selected from the groupconsisting of aluminum oxide, aluminum nitride, silicon nitride, siliconcarbide, and boron nitride.
 11. A heater module for semiconductormanufacturing equipment as set forth in claim 9, wherein said heaterpart is superficially covered with metal at least where said heaterabuts with said block part.
 12. A heater module for semiconductormanufacturing equipment as set forth in claim 1, wherein said block partis at least one selected from the group consisting of aluminum,magnesium, copper, iron, stainless steel, aluminum oxide, aluminumnitride, silicon nitride, silicon carbide, and boron nitride.
 13. Aheater module for semiconductor manufacturing equipment as set forth inclaim 1, wherein said block part is either identical or similar to saidheater part in form, and said block part in diametrical dimension iswithin ±25% of said heater part in diametrical dimension.
 14. A heatermodule for semiconductor manufacturing equipment as set forth in claim1, wherein either said heater part or said block part is shiftedrelative to the other by means of oil pressure.
 15. A heater module forsemiconductor manufacturing equipment as set forth in claim 1, whereinthe cooling speed of said heater part is 10° C./min or more.
 16. Aheater module for semiconductor manufacturing equipment as set forth inclaim 1, wherein while a wafer set in place on said heater part is beingcooled, the heater module has an isothermal rating that is within ±1%.17. A heater module for semiconductor manufacturing equipment as setforth in claim 1, utilized in CVD equipment, etcher equipment,coater/developer equipment, or a low-k dielectric baking device. 18.Semiconductor manufacturing equipment having installed therein a heatermodule for semiconductor manufacturing equipment as set forth inclaim
 1. 19. A heater module for semiconductor manufacturing equipmentas set forth in claim 1, wherein said block part is shiftable intoabutment on a bottom part of a chamber in the semiconductormanufacturing equipment.
 20. A heater module for semiconductormanufacturing equipment as set forth in claim 19, wherein the chamberbottom is water-cooled.
 21. A heater module for semiconductormanufacturing equipment as set forth in claim 1, wherein either saidheater part or said block part is shifted relative to the other by meansof air pressure.